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Taipei, April 20 /PRNewswire/

With the launch of the AMD Ryzen™ 7000 series desktop processors built on the new Zen 4 architecture, the world’s leading computing brand, GIGABYTE today announced the B650E and B650 motherboards, ready to power the next generation of CPUs. With the new AM5 socket, AORUS B650E and B650 gaming motherboards come with a direct digital power design and a fully enclosed cooling unit to keep electronics cool. AORUS motherboards feature PCIe 5.0 connectivity and support for DDR5 memory that supports AMD EXPO™ and Intel® XMP up to DDR5-6600 and later. AORUS gaming motherboards come with easy-to-install PCIe and M.2 hardware, making future upgrades quick and easy.

Power delivery and thermal design have always been the most important factors when it comes to CPU performance. To meet the demands of gamers looking for powerful and stable system performance, AORUS B650E and B650 gaming motherboards are equipped with a maximum of 16 + 2 + 2 phases of dual digital power delivery. The case is encased in a massive heatsink with four times more surface area than the previous generation to ensure smooth power delivery even under load. Other thermal designs, such as massive 8mm heatpipes and custom heatsinks on key components, greatly improve system stability and overall performance. Thanks to the intuitive design of PCIe and M.2 EZ-Latch functionality on AORUS B650 gaming motherboards, GIGABYTE makes component replacement much easier.

GIGABYTE will release a total of 14 motherboards, including B650E AORUS TACHYON, B650E AORUS MASTER, B650 AORUS ELITE AX, B650 AERO G, B650I AORUS ULTRA, etc., which will be available from October 10. For more information about GIGABYTE X670E and X670 motherboards, please visit our website:

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Media contact:

Phoebe Huang
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